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Board Design Engineer
Responsibilities:
- Specify and design Ball Grid Array electronic packages
- Work with a cross functional team to define the package ballout, power distribution, signal interconnect scheme, and chip pad ring necessary to implement a robust electrical design
- Supervise the package layout design process
Minimum Requirement:
- BE (EE) with 5+ years experience is required
- Experience in transmission line theory and practice
- Prior experience in board / system design or package design is preferred
- Tool use includes Cadence APD and Valor
- Script based programming language and EXCEL familiarity are helpful
Previous Experience:
- Candidate may come from a system or board design career path
- Experience with high speed interfaces like DDR, USB, DAC is helpful
- Market segments like embedded devices, networking, mass storage, computer systems will provide potential candidates
- High speed signaling and interconnect experience which relies upon knowledge of transmission lines and distributed electrical paracitics is required
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